NuKlean Cu-C Non-Etching Copper & Copper-Alloy Cleaner

About NuKlean Cu-C

NuKlean Cu-C is a low-foaming aqueous cleaner engineered specifically for copper and copper alloys. It removes organics, grease, oils, organometallic contamination and particulate soils while cleaning without etching or attacking the underlying copper surface.

Unlike cleaners that intentionally microetch copper during surface preparation, NuKlean Cu-C preserves the existing substrate while producing a clean, defect-free surface for subsequent processing. A robust anti-tarnish system helps maintain the cleaned copper surface during storage, allowing greater flexibility between cleaning and downstream manufacturing operations.

NuKlean Cu-C is designed as a pretreatment step before precision processes including microetching, adhesion promotion and coating. It may be used in immersion or spray applications at 10–20% concentration from 70°F to 140°F. Temperature and dwell time can be adjusted according to soil loading and required cleanliness. NuGenTec specifically recommends NuKlean Cu-C before NuEtch Cu-PE, NuKlean Cu-AP, or NuEtch Cu-ME.