NuKlean Cu-AP Copper Cleaner & Adhesion Promoter

About NuKlean Cu-AP

NuKlean Cu-AP is an acidic copper and copper-alloy cleaner and adhesion promoter designed to create a controlled micro-etched surface that improves bonding between metallic substrates and organic polymers. The treatment produces a unique surface topography that provides a more effective mechanical and chemical interface for subsequent coating, lamination and imaging processes.

Originally developed for inner-layer bonding in printed circuit board manufacturing, NuKlean Cu-AP is also effective for promoting adhesion of solder mask, photoresist and dielectric materials to copper surfaces. Its controlled micro-etching action can also be used wherever improved copper surface preparation and organic coating adhesion are required.

Beyond electronics manufacturing, NuKlean Cu-AP can be used in chemical milling, pre-paint and pre-powder-coat surface preparation. The product is effective at ambient temperature and may be operated up to 85°F, with dwell time and temperature adjusted to develop the desired surface topography and adhesion performance. For best results, NuGenTec recommends precleaning with NuKlean Cu-C before treatment.